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Celsius EC

Cooling verified before the enclosure is built

Celsius EC Solver calculates airflow, thermal conduction, and radiation in electronics enclosures — using fans, heatsinks, heat pipes, and cold plates as ready-to-use objects, directly based on your own CAD geometry.

The challenge

It costs you time and money

  • Cooling is evaluated based on experience and safety margins
  • The CAD model must be simplified before it can be calculated
  • Fan and heatsink are selected before the consequences are known
  • Support responses that take days

The solution

We give you control back

  • Airflow and temperature calculated across the entire enclosure
  • MCAD models calculated without requiring prior simplification
  • Ready-to-use objects for fans, heatsinks, and heat pipes
  • Local hotline with responses from a specialist on the same day

HOW IT WORKS

Built for electronics, not adapted to it

The model is built from what is actually inside the enclosure

Over a hundred ready-to-use objects cover the components actually present in an electronic product. A board is a board, and a fan is a fan — not a geometry that has to be defined from scratch.

The mesh is generated automatically

The MLUS mesh is generated automatically based on the objects, placing resolution where it matters. This is typically the most time-consuming step in a general CFD tool.

Geometry originates directly from your own tools

MCAD from Creo, SolidWorks, and CATIA, and PCB data via ODB++ or IPC-2581. The model does not require simplification before calculation.

VALUE

EC Solver covers everything from component to enclosure

Ready-to-use objects, automated meshing, and the underlying physics that determine whether a product can cool itself effectively.

Model setup

What takes time in thermal analysis is rarely the solver run itself. It is building the model.

Over 100 ready-to-use objectsBoards, fans, heatsinks, enclosures
Heat pipes and cold platesWith true real-world properties
Model verificationErrors are caught before the calculation starts

Physics

Heat leaves an enclosure via multiple paths simultaneously, and all three must be calculated together.

Convection, conduction, and radiationIn the same calculation
Natural and forced coolingWith and without fans
Solar radiation and liquid coolingOutdoor equipment and high-power electronics

Meshing

Meshing is where thermal analysis most often stalls for engineers who do not perform it every day.

MLUS meshingGenerated automatically based on the objects
Resolution on demandFiner where the geometry requires it
No manual setupThe model is ready as soon as the geometry is

Geometry and data input

The enclosure already exists in MCAD, and the board exists in ECAD. Both must be directly usable.

Creo, SolidWorks, and CATIAMCAD without simplification
ODB++ and IPC-2581The board with layers and vias
A single modelMechanical and electronics data in one place

Studies and scaling

The initial calculation answers a single question. The true value lies in exploring further scenarios.

Parametric studiesGeometry, materials, and power as variables
Multi-core scalingAlso across distributed machines
Reports and 3D visualizationClear presentation of results for the entire team

Implementation

How EC Solver works in practice

1. Start with a familiar product

An enclosure where you already have known thermal data is the best starting point. The model can be verified against empirical measurements from day one.

2. Guidance on what to include in the model

How detailed the board needs to be, which components are critical, and when simplification is appropriate. These decisions determine both run time and reliability, and we provide technical guidance throughout.

3. Local expertise and continuous support

You get direct access to specialists with practical experience in CFD and thermal management. Questions about a specific model receive concrete answers during an active project.

Ready?

Ready to design with peace of mind?

A short conversation is usually enough to determine whether EC Solver is the right fit. No sales pitch. No pressure. Just a technical discussion about the enclosures and power dissipation requirements of your products.

FAQ

Frequently Asked Questions

Both calculate flow and heat transfer. EC Solver is built for electronics cooling, where fans, heat sinks, and boards exist as ready-made objects, and where meshing is automated. Fidelity CFD is built for general flow — turbomachinery, marine applications, and aerodynamics — where fine control over the mesh matters most. If the task involves an electronics enclosure, EC Solver is typically the most direct route.

No, not to get started. The model is built using pre-defined objects, and meshing is automated. However, the results still need to be evaluated by someone who understands the model's inputs — and that is where we can assist.

Yes. EC Solver became part of Cadence with the acquisition of Future Facilities in 2022 and was previously known as 6SigmaET. It is the same tool, and some customers still know it by its former name.

Yes, and that is often the right approach. EC Solver covers the airflow and enclosure, while Thermal Solver covers the chip and package. Both are part of the same platform, Celsius Studio.

Contact us

Let us review your setup – without obligation.

A brief dialogue is often enough to clarify if Nordcad is the right choice for you. No pitch. No pressure.

15+ specialists