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Your entire PCB flow in one tool, from schematic to 3D layout and simulation.
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Try for free for 30 days Celsius Studio
Celsius Studio is Cadence's unified platform for thermal analysis of electronics. Three solvers each cover their own level — current in the board, chip and package, and air in the enclosure — reading the design directly from your ECAD and MCAD tools.
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The challenge
The solution
PORTFOLIO
Each solver is built for its specific level. Which one you need depends on where the heat is generated and where it needs to go.
IR drop, current density, and current through vias, calculated together with the heat generated by the current itself. Reads the design directly from OrCAD and Allegro, requiring no models to get started.
Temperature in chip, package, and board with coupled electrical and thermal analysis. Both steady-state and transient, allowing temperature to be tracked during product operation.
Airflow, convection, and radiation in enclosures, with fans, heatsinks, heat pipes, and cold plates available as ready-to-use objects. MCAD models can be calculated without prior simplification.
HOW IT CONNECTS
Resistance increases with temperature, and higher resistance generates more heat. Calculating the two separately leads to inaccurate results for both. In Celsius, they are coupled in the same calculation.
Board, chip, package, and enclosure operate within the same platform. This means the temperature of a component can be analyzed in the context of the surrounding airflow — rather than assumed as a fixed value.
PCB data is read from Allegro and OrCAD as well as other ECAD tools, including ODB++ and IPC-2581 formats. Mechanical data can be imported from tools like Creo, SolidWorks, or CATIA.
THE FULL SUITE
Ready?
A brief conversation is usually enough to clarify at which level your thermal challenge lies — and whether it requires one solver or several. No sales pitch. No pressure. Just a straightforward discussion about your design challenges.
FAQ
It depends on where the heat is generated. If it is current in the board — IR drop, hot copper traces, overheating vias — PowerDC is the right choice. If it is temperature within a chip or package, Thermal Solver is used. If it concerns the enclosure and cooling, EC Solver is the solution. We are glad to review this together before you decide.
Both simulate fluid flow and heat, but they are built for different applications. EC Solver is designed for electronics cooling: fans, heatsinks, and PCBs are available as built-in objects, and ECAD data is imported directly. Fidelity CFD is built for general fluid dynamics — turbomachinery, marine applications, aerodynamics — where mesh control is critical. If your task is within an electronics enclosure, EC Solver is typically the most direct path.
PowerDC calculates DC conditions: IR drop, current density, and the heat generated by the current. Sigrity X covers the AC domain — power integrity at high frequencies and signal integrity. Many teams use both, as they address two distinct questions regarding the same board.
No. Celsius reads data directly from both OrCAD and Allegro, and data from other ECAD tools can be imported via formats such as ODB++ and IPC-2581. Mechanical data can come from tools like Creo, SolidWorks, and CATIA.
Celsius Studio can calculate thermal stress and warpage, but not drop, shock, and vibration for the complete product — which requires structural analysis tools. And for fluid flow outside of electronics, Fidelity CFD is the appropriate solution. We will let you know if your requirements are better addressed elsewhere in the portfolio.
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A brief dialogue is often enough to clarify if Nordcad is the right choice for you. No pitch. No pressure.
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