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Your entire PCB flow in one tool, from schematic to 3D layout and simulation.
Try for free for 30 daysYour entire PCB flow in one tool, from schematic to 3D layout and simulation.
Try for free for 30 days Celsius Thermal Solver
Celsius Thermal Solver calculates the temperature from the chip to the finished system using heat conduction, convection, and radiation in a single model—and with the electrical analysis integrated, so the temperature is not an estimate.
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The challenge
The solution
HOW IT WORKS
Heat conduction through materials is calculated using the finite element method, while convection and radiation are calculated using fluid dynamics. These methods are used together because heat rarely travels in only one direction.
From die and package to board and enclosure. This means that the temperature of a component can be viewed in the context of its surroundings.
The power loss is derived from the electrical analysis rather than from a spreadsheet, and the temperature is fed back. That is the difference between a thermal analysis and an electrothermal analysis.
VALUE
Electrothermal analysis, transient behavior, 3D-IC, and mechanical consequences—all calculated using the same model.
Power is converted into heat, and heat alters electrical behavior. Both factors are included in the same calculation.
A product rarely operates under a constant load. It is the operating cycle that determines how hot it gets.
The more tightly the components are packed, the more heat determines what is even possible.
Heat isn't just a temperature reading. It becomes a movement within the materials.
The thermal analysis is only useful if it can be run on the design currently being worked on.
Implementation
The most instructive first experiment is one involving a component that you already know gets too hot. That way, you can compare the model to something you've measured.
The results are only as good as the input data: material properties, power losses, and what happens at the model’s boundaries. We advise on what’s worth spending time on and what can be simplified.
You’ll have access to specialists who are knowledgeable about both the electronics and the thermal aspects. Questions about a specific model will be answered during an active project.
Ready?
A brief conversation is usually enough to determine the root cause of your overheating problem. No sales pitch. No pressure. Just an open discussion about the design that’s running too hot.
FAQ
Thermal Solver is designed for electrical components: chips, packages, and boards, with power loss and temperature linked together. EC Solver is designed for cooling: air, fans, heat sinks, and enclosures, with predefined objects for these components. If the problem lies in the component, use Thermal Solver. If it lies in the enclosure, use EC Solver.
Thermal Solver can calculate thermal stress and warpage. If you need to move on to drop, impact, vibration, or nonlinear mechanics analysis of the entire product, you’ll need actual structural analysis tools. That’s where system-level analysis begins.
Accurate enough to rank components. Even rough figures show where heat accumulates and which components are critical. If the results are to be used as documentation, the power losses must be derived from the electrical analysis rather than from the maximum values listed in the data sheet.
No. Integration is most seamless with Allegro X and Virtuoso Studio, but data can also come from other ECAD tools.
Contact us
A brief dialogue is often enough to clarify if Nordcad is the right choice for you. No pitch. No pressure.
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