Your entire PCB flow in one tool, from schematic to 3D layout and simulation.
Try for free for 30 days
A library the design process can rely on.
PCB designFrom schematic to layout with full control.
Simulation & analysisFind the errors before the prototype does.
Thermal Simulation and AnalysisHeat accounted for from copper to enclosure.
CFD meshing & simulationThermal and flow analysis for robust designs.
RF and Antenna DesignAt high frequencies, the copper matters.
Wireless Communication & IoTRange is decided by the final millimetres.
System-Level DesignThermal and mechanical aspects calculated in time.
PLMThe current version, in one place.
Data CenterCooling determines the capacity.
Cloud ServicesComputing power when the calculation is too large.
Your entire PCB flow in one tool, from schematic to 3D layout and simulation.
Try for free for 30 daysSpecialists who work in the tools themselves.
Nordcad Customer PortalCases, licences, and downloads gathered in one place.
Software DevelopmentIntegrations and solutions that eliminate intermediate work.
MigrationFrom your legacy PCB tool to OrCAD X.
Cadence KnowledgeCadence's knowledge base with articles and guides.
Your entire PCB flow in one tool, from schematic to 3D layout and simulation.
Try for free for 30 daysYour entire PCB flow in one tool, from schematic to 3D layout and simulation.
Try for free for 30 days Clarity
Clarity is Cadence's 3D electromagnetic analysis. One solver answers whether the signal survives the path through the connector, cable, or package. The other answers what radiates from the finished product before it enters a test chamber.
"*" indicates required fields
PORTFOLIO
Both calculate electromagnetic fields in three dimensions. The difference is whether you need to know what happens inside the interconnect or what radiates from the enclosure.
Near-field · interconnect
Connectors, cables, vias, packages, and transitions. The result is a structural model that can be used directly in signal analysis.
Far-field · EMI and EMC
The complete system with enclosure, cables, and boards. For the radiation that determines whether the product passes EMC testing.
HOW IT CONNECTS
At high speeds, a connector or a via is not just a wire, but a structure with its own characteristics. That is where 3D Solver is used.
EMC requirements concern what leaves the product. This requires calculating enclosure, cables, and boards together, and that is where Transient Solver is used.
A product can easily have a reliable connection and still fail the EMC test. The two analyses answer separate questions, and many teams need both.
The challenge
The solution
THE FULL SUITE
Ready?
A short conversation is usually enough to clarify which of the two solvers answers your question. No pitch. No pressure. Just an open discussion about where your designs typically run into issues.
FREQUENTLY ASKED QUESTIONS
If the question is whether a signal gets through a structure, you need 3D Solver. If it is about what radiates from the product, it is Transient Solver. If you are in doubt, it is usually because both are at play.
No. The product must still be tested. Simulation shifts the verification earlier, so you know what happens before booking test time — and so changes can be evaluated without the cost of a retest.
Sigrity X calculates the design as drawn in ECAD: traces, planes, and vias. Clarity calculates the physical 3D structure, including areas where there is no layout to import — the connector, the cable, the enclosure. The two are often used together, with Clarity providing the structural model for signal analysis.
Both are 3D EM solvers. Analyst is part of the RF flow in AWR and is used alongside circuit design on high-frequency structures. Clarity belongs in electronics simulation and is used for interconnects, packages, and complete systems. The choice usually follows the design environment you work in.
Contact us
A brief dialogue is often enough to clarify if Nordcad is the right choice for you. No pitch. No pressure.
15+ specialists
