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Thermal Simulation and AnalysisHeat accounted for from copper to enclosure.
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Your entire PCB flow in one tool, from schematic to 3D layout and simulation.
Try for free for 30 daysYour entire PCB flow in one tool, from schematic to 3D layout and simulation.
Try for free for 30 days SOLUTION · THERMAL SIMULATION
Heat is the only physical limitation not specified in the design rules. It becomes apparent during the first functional test—or at the customer’s site after six months. It can be calculated long before that.
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The challenge
The solution
THE LEVELS
A thermal problem is rarely solved right where it arises. That is why calculations are performed on three levels, and these levels are interconnected.
The current flowing through planes and paths causes voltage drops and generates heat. This is where the heat comes from, and this is where it is cheapest to address the issue.
Result: a circuit board where the current paths are sized appropriately for the task.
The components heat each other up. Their placement determines whether the heat is distributed or concentrated in one spot.
Result: a layout that keeps the components within their limits.
The air has to escape. The case, ventilation, and surroundings determine whether the card's cooling system works at all.
Result: a product that maintains a stable temperature, even under the hottest operating conditions.
DISCIPLINES
They are related, but they are rarely asked at the same time—and rarely by the same person.
Electric current and heat affect each other: resistance increases with temperature, and temperature increases with current.
Data sheets specify a limit. The question is, what are the component's actual performance levels in its actual operating environment?
The card may be fine, but the product could still be too hot. The case determines where the heat ends up.
Few products operate continuously at full load. What determines their service life is how they perform over time.
TOOLS
Celsius Studio covers everything from the copper to the cabinet. Most people start in one area and expand as the need arises.
Platform
The comprehensive thermal platform: electrical-thermal analysis, schematics, components, and the enclosure, all in the same environment.
Tools
Voltage drop, current density, and the heat generated by the current in the copper.
tool: The temperature of the board and the individual components.
Tools
: The case, the airflow, and the cooling around the electronics.
THE FULL SUITE
Compare
A local partner who knows your software and your challenges makes all the difference when things get critical.
| What you get | Nordcad | Standard reseller |
|---|---|---|
| EDA and simulation tools from CadenceThe entire Celsius Studio suite available from a single partner: PowerDC, Thermal Solver, and EC Solver. | ||
| Local hotline with real peopleYou speak with a specialist who knows your software. No ticketing systems or waiting queues. | ||
| Training and webinars in DanishOpen courses, on-site sessions, and webinars in your own language, tailored to your level. | ||
| Support for migration and setupWe assist with installation, license rehosting, and library and design migration. | ||
| Response within one business dayUrgent cases are prioritized by a human, so you rarely wait more than a few hours. | ||
| A single partner for the entire flowTools, support, and guidance in one place. |
RESOURCES
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FAQ
It covers heat transfer. The electrical aspects—the circuit, signals, power supply, and radiation—are covered on the simulation and analysis page. Flow and meshing are covered on the CFD page. The three are related, but each is addressed using its own tools.
If the question involves electronics—boards, components, enclosures—it's Celsius. If it involves the flow itself, fluids, or geometry without electronics, it's Fidelity CFD.
For a single card with plenty of space: often yes. It stops working when the components heat each other up or when the case restricts airflow. That’s when the estimate becomes a guess.
The layout and thermal models for the components that generate the most heat. The rest can usually be estimated, and we'll help you determine what's good enough.
Part of the way. Both OrCAD X and Allegro X can give you an idea. If the result is to be used to make a decision about cooling or presented to a customer, Celsius is the answer.
It's the same technology on a different scale. See the solutions page on data centers.
Contact
The quickest way to evaluate thermal simulation is to run it on a design for which you already know the results. If you had a product that had to be modified at the last minute, that’s the best place to start. No sales pitch. No pressure.
Contact us
A brief dialogue is often enough to clarify if Nordcad is the right choice for you. No pitch. No pressure.
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